SCI announces release of Swing-DUO™ (Dynamic Uniformity Optimization) software

Sputtering Components proudly announces the release of the Swing-DUO™ (Dynamic Uniformity Optimization) software. This web-based software is designed to work exclusively with the SCI Swing Cathode™ and magnetics. The result is a customer-specific motion profile CAM table.

The motion profile used to control the magnet bar movement is a function of the array geometry and can be simulated and optimized for customer-specific geometries. Some of the software inputs include number of cathodes used, cathode spacing, substrate and target material dimensions, and type of magnet bar used.

An optimized array of standard rotary magnetrons can meet or exceed the uniformity requirements of many processes, but still does not address the target profile changes as the target materials wears away. SCI customers will have the ability to adjust the motion profile to accommodate this erosion.

For more information, plase visit the Swing Duo™ product page, or contact us at sales@sputteringcomponents.com.